极大规模集成电路制造装备与成套工艺专项
Great scale integrated circuit manufacturing equipment and complete set of special technology
  • 基本信息
  • 报告类型:  最终报告 编制日期:  2021-02-06 公开范围:  不公开 全文页数:  45页
    中文关键词:  集成电路
    英文关键词:  Integrated circuit
  • 中文摘要

“十二五”期间重点实施的内容和目标分别是:重点进行45-22纳米关键制造装备攻关,开发32-22纳米互补金属氧化物半导体(CMOS)工艺、90-65纳米特色工艺,开展22-14纳米前瞻性研究,形成65-45纳米装备、材料、工艺配套能力及集成电路制造产业链,进一步缩小与世界先进水平差距,装备和材料占国内市场的份额分别达到10%和20%,开拓国际市场。

  • 英文摘要

The content and target of 12th Five-Year "period are: focus on the implementation of the key 45-22 nano key manufacturing equipment research and development of nano 32-22 complementary metal oxide semiconductor (CMOS) technology, 90-65 technology of 22-14 nano nano features, prospective study, the formation of 65-45 nano materials, equipment, technology supporting capacity and integrated circuit manufacturing industry chain. To further narrow the gap with the world advanced level, equipment and materials for the domestic market share reached 10% and 20% respectively, to develop the international market.